IEC 62769-4 Ed. 3.0 b:2023
IEC 62769-4 Ed. 3.0 b:2023 Field Device Integration (FDI) - Part 4: FDI Packages
standard byInternational Electrotechnical Commission , 04/01/2023
This part of IEC 62769 specifies the FDI®1 Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure.
Product Details
Edition:
3.0Published:
04/01/2023ISBN(s):
9782832267943Number of Pages:
186File Size:
1 file , 3 BytesNote:
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