IEC 62769-6 Ed. 3.0 b:2023

IEC 62769-6 Ed. 3.0 b:2023

IEC 62769-6 Ed. 3.0 b:2023 Field Device Integration (FDI) - Part 6: FDI Technology Mapping

standard byInternational Electrotechnical Commission , 04/01/2023

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This part of IEC 62769 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®1) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.

Product Details

Edition:

3.0

Published:

04/01/2023

ISBN(s):

9782832264775

Number of Pages:

18

File Size:

1 file , 550 Bytes

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus

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