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IEC 61189-2-803 Ed. 1.0 b:2023

IEC 61189-2-803 Ed. 1.0 b:2023

IEC 61189-2-803 Ed. 1.0 b:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

standard byInternational Electrotechnical Commission , 07/01/2023

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This part of IEC 61189 specifies a test method to determine the Z-axis expansion of base
materials and printed boards using a thermomechanical analyser (TMA).

Product Details

Edition:

1.0

Published:

07/01/2023

ISBN(s):

9782832272640

Number of Pages:

20

File Size:

1 file , 706 Bytes

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus

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