This document is used for testing electromechanical elementary relays (electromechanical relays, reed relays, reed contacts, reed switches and technology combinations of these) and for evaluating their ability to perform under expected conditions of transportation, storage and all aspects of operational use.

This document defines a standard test method to simulate the mechanical stress on relays as it can occur in service, during handling or during transportation. This document comprises test procedures to simulate shock impacts, steady acceleration environments (such as moving vehicles, aircraft and projectiles) as well as vibration conditions.

The tests are generally intended to be carried out with devices under test (DUTs) without packaging. However, if the packaging is considered an essential part of the DUT, then the defined tests can be carried out with packaging as well.

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