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IEC 63378-3 Ed. 1.0 b:2025

IEC 63378-3 Ed. 1.0 b:2025

IEC 63378-3 Ed. 1.0 b:2025 Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis

standard byInternational Electrotechnical Commission , 05/01/2025

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This part of IEC 63378 specifies the thermal circuit network model of discrete (TO-243, TO-252 and TO-263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification.

This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.

Product Details

Edition:

1.0

Published:

05/01/2025

ISBN(s):

9782832703991

Number of Pages:

32

File Size:

1 file , 1 Byte

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus

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