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IEC 61189-3-302 Ed. 1.0 en:2025

IEC 61189-3-302 Ed. 1.0 en:2025

IEC 61189-3-302 Ed. 1.0 en:2025 HistoricalTest methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

standard byInternational Electrotechnical Commission , 10/01/2025

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IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated
circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.

Product Details

Edition:

1.0

Published:

10/01/2025

ISBN(s):

9782832707777

Number of Pages:

22

File Size:

1 file , 2 Bytes

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus

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